Siti Nur Rahmah Anwar
Welds, bolts, screws, rivets, and other special devices such as metal stitching and adhesives are generally used for cold-formed steel joints. Adhesive bonding is an effective method of joining many materials. The AISI Specification contains only the design provisions for welded connections, bolted connections, and screw connections. Adhesively bonded joints are an increasing alternative to mechanical joints in engineering applications and provide many advantages over conventional mechanical fasteners. They provide a more uniform stress distribution along the bonded area, which enables to have a higher stiffness and load transmission, reducing the weight and thus the cost. Adhesives can bond dissimilar materials with different coefficients of thermal expansion because the adhesive flexibility can compensate the difference. They bond thin plates very efficiently, which is one of the major applications of structural. The one of adhesive types is epoxy resin. In this paper, a chemical test and mechanical test was conducted on S-CFN adhesive using XRD method and universal testing machine to obtain material properties for building application. The chemical composition and mechanical properties of epoxy resin S-CFN adhesive is enough strength for application of cold-formed steel joint. The chemical formula and composition of the S-CFN adhesive are can be obtained as calcium carbonate (CaCO3) and silica dioxide (SiO2). The silica dioxide (SiO2) is a filler in adhesives, with the aim of increasing the adhesive properties significantly. The compressive strength of epoxy resin (S-CFN adhesive) is 45.54â MPa. While, the elastic modulus of epoxy resin (S-CFN adhesive) is 6666 N/mm2. The tensile strength of epoxy resin (S-CFN adhesive) is 15.53â MPa. While the characteristics of the S-CFN adhesive material for fracture energy (Gf) and Poisson ratio values obtained are 1.2â kJ or Nm and 0.28. © 2023 Author(s).
Civil Engineering Department of Universitas Negeri Malang, Semarang Street No. 5, Malang, Indonesia
